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Longji Company completed the experimental research of diamond wire cutting process
Abstract Recently, the reporter learned from reliable channels that Xi'an Longji Silicon Materials Co., Ltd. has basically completed the "Diamond Wire Cutting Process Research" experiment, and has completed the research of 130μm sheet cutting process in China. In 2013, it will become the first large-scale application. gold...
Recently, the reporter learned from reliable channels that Xi'an Longji Silicon Materials Co., Ltd. has basically completed the "Diamond Wire Cutting Process Research" experiment, and has completed the research of 130μm sheet cutting process in China. In 2013, it will become the first large-scale promotion and application of King Kong. Domestic companies with wire cutting technology. Diamond wire cutting technology has become the development direction and replacement technology of hard and brittle material cutting technology such as silicon crystal. The company is the first to use this technology, which will lead the new wave of domestic silicon wafer cutting technology. At the same time, the technology's superiority in improving equipment cutting capacity, reducing production costs, and high efficiency and environmental protection will effectively guarantee the sustainability of the company's cost control advantages. In 2008-2009, Longji Company took into account the popularization trend of diamond wire cutting technology in the future when the company purchased the slicer in batches. All the slicing equipment can be quickly transformed into diamond wire cutting process. At present, 17 slicers have completed the process transformation. Of these, 13 have begun to produce diamond wire-cut silicon wafers in batches.